Electronic Potting Compound
Part A: an odorless gray/red/black liquid colloid.Part B: an aqueous liquid in transparent color.
Part A: an odorless gray/red/black liquid colloid.
Part B: an aqueous liquid in transparent color.
1.Flexible fluidity for easy pouring.
2.Strong Adhesion.
3.Good heat resistance.
4.Excellent insulation performance.
5.Water/dust/aging proof.
6.Good shelf-life.
Tin-based electronic potting compound is especially developed for electronic potting and encapsulating applications, such as electronic components, electronic marketing tools, electronic equipment, etc.
Operation Method: by pouring or machine injection
Model Code - GTSIL | TE 10 | TE 15 | TE 50 | |||
Appearance | Part A | Part B | Part A | Part B | Part A | Part B |
Transparent | Yellowish | Black | Yellowish | Red | Transparent/Yellowish | |
Hardness - Shore A | 13-17 | 13-17 | 40-50 | |||
Mixing Ratio - % by W. | 10:1 | 10:1 | 100:3 | |||
Mixed Viscosity -Cps | 2500-3500 | 2500-3500 | 12000-18000 | |||
Working Time-Mins | 60-120mins | 60-120mins | 40-60mins | |||
Basically Cured, Hrs | 3Hrs | 3Hrs | 3Hrs | |||
Perfectly Cured, Hrs | 24Hrs | 24Hrs | 24Hrs | |||
Cementability | Good | Very Good | Very Good | |||
Thermal Conductivity[W(m.K)] | >0.2 | >0.4 | >0.4 | |||
Dielectric Strength(kV/mm) | >25 | >25 | >25 | |||
Dielectric Permitivity(1.2MHz) | 3.0-3.3 | 3.0-3.3 | 3.0-3.3 | |||
Volume Resistivity (Q • cm ) | >1.0x1014 | >1.0x1014 | >1.0x1014 | |||
Fire Resistance | UL94V1 | UL94V1 | UL94V1 | |||
Packing: 10kg, 20kg, 25kg, 200kg.